Co-Sponsored by:
IEEE SMC
Zhejiang University
The Chinese University of Hong Kong
Tsinghua University
1、Conference Co-Chairs:
Xiaoqiang Cai, The Chinese University of Hong Kong, Hongkong, China
Jian Chen, Tsinghua University, China
Weihua Zhou, Zhejiang University, China
2、International Advisory Committee:
Daniel Berg, Rensselaer Polytechnic Institute, USA
Philip Chen, University of Macau, China
Chung-Yee LEE, Hong Kong University of Science and Technology, China
J. M. Tien, University of Miami , USA
3、International Program Committee Co-Chair:
Liping Fang, Ryerson University, Canada
Liqiang Huang, Zhejiang University, China
Yongbo Xiao, Tsinghua University, China
Yi Yang, Zhejiang University, China
4、Local Organizing Committee Co-Chair:
Zhongsheng Hua, Zhejiang University, China